Compare TWIN & SHMD Stocks: Price Trends, ML Decisions, Charts, Trends, Technical Analysis and more.
Current Price
| Metric | TWIN | SHMD |
|---|---|---|
| Founded | 1918 | 1864 |
| Country | United States | Germany |
| Employees | N/A | 734 |
| Industry | Industrial Machinery/Components | |
| Sector | Industrials | |
| Exchange | Nasdaq | Nasdaq |
| Market Cap | 269.7M | 358.1M |
| IPO Year | 1994 | N/A |
| Metric | TWIN | SHMD |
|---|---|---|
| Price | $22.24 | $4.38 |
| Analyst Decision | | |
| Analyst Count | 0 | 0 |
| Target Price | N/A | N/A |
| AVG Volume (30 Days) | 188.8K | ★ 848.5K |
| Earning Date | 05-06-2026 | 05-15-2026 |
| Dividend Yield | ★ 0.98% | N/A |
| EPS Growth | N/A | ★ N/A |
| EPS | ★ 1.76 | N/A |
| Revenue | ★ $340,738,000.00 | N/A |
| Revenue This Year | $10.79 | N/A |
| Revenue Next Year | $8.43 | N/A |
| P/E Ratio | $12.56 | ★ N/A |
| Revenue Growth | ★ 15.45 | N/A |
| 52 Week Low | $8.03 | $2.00 |
| 52 Week High | $24.50 | $10.65 |
| Indicator | TWIN | SHMD |
|---|---|---|
| Relative Strength Index (RSI) | N/A | N/A |
| Support Level | N/A | N/A |
| Resistance Level | N/A | N/A |
| Average True Range (ATR) | 0.00 | 0.00 |
| MACD | 0.00 | 0.00 |
| Stochastic Oscillator | 0.00 | 0.00 |
Twin Disc Inc is a United States-based firm engaged in the manufacture and sale of marine and heavy-duty off-highway power transmission equipment. The company operates its business through two reportable segments: Manufacturing and Distribution. Its product portfolio includes marine transmissions, surface drives, propellers, and boat management systems as well as power-shift transmissions, hydraulic torque converters, power take-offs, industrial clutches, and control systems.
Schmid Group NV is a supplier of equipment, software and services for various industries such as printed circuit board (PCB), substrate manufacturing, photovoltaics, and glass and energy storage with a focus on the highest end of this market in terms of technology and performance. It focuses on a modular product portfolio of machinery to use in the manufacturing of high-end PCB equipment and semiconductor packaging devices which includes common flexible circuit fabrication techniques such as subtractive, semi-additive processes (SAP) and modified semi-additive processes (mSAP).