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SHMD vs FCCO Comparison

Compare SHMD & FCCO Stocks: Price Trends, ML Decisions, Charts, Trends, Technical Analysis and more.

  • Machine Learning Prediction
  • ML Decision
  • SHMD
  • FCCO
  • Stock Information
  • Founded
  • SHMD 1864
  • FCCO 1994
  • Country
  • SHMD Germany
  • FCCO United States
  • Employees
  • SHMD N/A
  • FCCO N/A
  • Industry
  • SHMD
  • FCCO Major Banks
  • Sector
  • SHMD
  • FCCO Finance
  • Exchange
  • SHMD Nasdaq
  • FCCO Nasdaq
  • Market Cap
  • SHMD 144.3M
  • FCCO N/A
  • IPO Year
  • SHMD N/A
  • FCCO 1998
  • Fundamental
  • Price
  • SHMD $2.58
  • FCCO $22.97
  • Analyst Decision
  • SHMD
  • FCCO Buy
  • Analyst Count
  • SHMD 0
  • FCCO 1
  • Target Price
  • SHMD N/A
  • FCCO $21.00
  • AVG Volume (30 Days)
  • SHMD 51.8K
  • FCCO 31.8K
  • Earning Date
  • SHMD 02-25-2025
  • FCCO 01-22-2025
  • Dividend Yield
  • SHMD N/A
  • FCCO 2.63%
  • EPS Growth
  • SHMD 1309.32
  • FCCO 2.46
  • EPS
  • SHMD 1.07
  • FCCO 1.69
  • Revenue
  • SHMD $99,752,404.00
  • FCCO $62,732,000.00
  • Revenue This Year
  • SHMD N/A
  • FCCO N/A
  • Revenue Next Year
  • SHMD N/A
  • FCCO $11.21
  • P/E Ratio
  • SHMD $2.30
  • FCCO $13.19
  • Revenue Growth
  • SHMD N/A
  • FCCO 6.16
  • 52 Week Low
  • SHMD $1.98
  • FCCO $15.40
  • 52 Week High
  • SHMD $6.13
  • FCCO $26.48
  • Technical
  • Relative Strength Index (RSI)
  • SHMD N/A
  • FCCO 35.98
  • Support Level
  • SHMD N/A
  • FCCO $22.11
  • Resistance Level
  • SHMD N/A
  • FCCO $24.07
  • Average True Range (ATR)
  • SHMD 0.00
  • FCCO 0.45
  • MACD
  • SHMD 0.00
  • FCCO -0.18
  • Stochastic Oscillator
  • SHMD 0.00
  • FCCO 36.29

About SHMD SCHMID Group N.V. Class A Ordinary Shares

Schmid Group NV is a global supplier of equipment, software and services for various industries such as printed circuit board (PCB), substrate manufacturing, photovoltaics, and glass and energy storage with a focus on the highest end of this market in terms of technology and performance. It focuses on a modular product portfolio of machinery to use in the manufacturing of high-end PCB equipment and semiconductor packaging devices which includes common flexible circuit fabrication techniques such as subtractive, semi-additive processes (SAP) and modified semi-additive processes (mSAP).

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