Compare RWAY & SHMD Stocks: Price Trends, ML Decisions, Charts, Trends, Technical Analysis and more.
| Metric | RWAY | SHMD |
|---|---|---|
| Founded | 2015 | 1864 |
| Country | United States | Germany |
| Employees | N/A | N/A |
| Industry | | |
| Sector | | |
| Exchange | Nasdaq | Nasdaq |
| Market Cap | 338.2M | 323.0M |
| IPO Year | 2021 | N/A |
| Metric | RWAY | SHMD |
|---|---|---|
| Price | $8.87 | $9.43 |
| Analyst Decision | Buy | |
| Analyst Count | 6 | 0 |
| Target Price | ★ $11.08 | N/A |
| AVG Volume (30 Days) | 303.9K | ★ 469.1K |
| Earning Date | 03-19-2026 | 01-01-0001 |
| Dividend Yield | ★ 15.64% | N/A |
| EPS Growth | ★ 44.67 | N/A |
| EPS | ★ 1.48 | N/A |
| Revenue | ★ $141,071,000.00 | $85,165,542.00 |
| Revenue This Year | N/A | N/A |
| Revenue Next Year | $3.74 | N/A |
| P/E Ratio | $6.04 | ★ N/A |
| Revenue Growth | ★ N/A | N/A |
| 52 Week Low | $8.35 | $1.90 |
| 52 Week High | $11.73 | $10.56 |
| Indicator | RWAY | SHMD |
|---|---|---|
| Relative Strength Index (RSI) | 38.73 | 64.05 |
| Support Level | $8.93 | $8.40 |
| Resistance Level | $9.31 | $10.56 |
| Average True Range (ATR) | 0.19 | 1.18 |
| MACD | -0.05 | 0.00 |
| Stochastic Oscillator | 27.89 | 66.34 |
Runway Growth Finance Corp is a specialty finance company focused on providing senior secured loans to high-growth-potential companies in technology, life sciences, healthcare information and services, business services, select consumer services and products, and other high-growth industries. The company has Investments in the United States, Germany, and UK, Canada, Netherlands, with the majority of its portfolio invested in the United States.
Schmid Group NV is a global supplier of equipment, software and services for various industries such as printed circuit board (PCB), substrate manufacturing, photovoltaics, and glass and energy storage with a focus on the highest end of this market in terms of technology and performance. It focuses on a modular product portfolio of machinery to use in the manufacturing of high-end PCB equipment and semiconductor packaging devices which includes common flexible circuit fabrication techniques such as subtractive, semi-additive processes (SAP) and modified semi-additive processes (mSAP).