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LPRO vs ASYS Comparison

Compare LPRO & ASYS Stocks: Price Trends, ML Decisions, Charts, Trends, Technical Analysis and more.

Logo Open Lending Corporation

LPRO

Open Lending Corporation

HOLD

Current Price

$1.21

Market Cap

167.8M

Sector

Finance

ML Signal

HOLD

Logo Amtech Systems Inc.

ASYS

Amtech Systems Inc.

HOLD

Current Price

$11.45

Market Cap

157.6M

Sector

Technology

ML Signal

HOLD

Company Overview

Basic Information
Metric
LPRO
ASYS
Founded
2000
1981
Country
United States
United States
Employees
N/A
N/A
Industry
Finance: Consumer Services
Industrial Machinery/Components
Sector
Finance
Technology
Exchange
Nasdaq
Nasdaq
Market Cap
167.8M
157.6M
IPO Year
2020
2006

Fundamental Metrics

Financial Performance
Metric
LPRO
ASYS
Price
$1.21
$11.45
Analyst Decision
Buy
Analyst Count
7
0
Target Price
$2.67
N/A
AVG Volume (30 Days)
504.8K
169.0K
Earning Date
03-12-2026
05-11-2026
Dividend Yield
N/A
N/A
EPS Growth
96.46
N/A
EPS
N/A
0.01
Revenue
N/A
$79,364,000.00
Revenue This Year
$10.12
$2.82
Revenue Next Year
$17.80
$18.75
P/E Ratio
N/A
$1,148.00
Revenue Growth
N/A
N/A
52 Week Low
$0.70
$3.20
52 Week High
$2.82
$18.59

Technical Indicators

Market Signals
Indicator
LPRO
ASYS
Relative Strength Index (RSI) 38.45 43.31
Support Level N/A $10.46
Resistance Level $1.56 $13.26
Average True Range (ATR) 0.13 0.75
MACD -0.01 -0.04
Stochastic Oscillator 8.99 24.84

Price Performance

Historical Comparison
LPRO
ASYS

About LPRO Open Lending Corporation

Open Lending Corp is engaged in providing automated lending services to financial institutions. The company offers loan analytics, risk-based pricing, risk modeling, and automated decision technology. Its Lenders Protection Program ("LPP") enables automotive lenders to make loans that are largely insured against, losses from defaults.

About ASYS Amtech Systems Inc.

Amtech Systems Inc provides equipment, consumables and services for semiconductor device packaging, wafer production and device fabrication. Its products are used to fabricate and package GPUs for AI applications, SiC and Si power devices, and other optical, analog and digital devices, and are sold to semiconductor packaging, electronic assembly and device fabrication companies. It operates through two segments: Thermal Processing Solutions, which includes conveyorized reflow equipment, high-temperature conveyorized furnaces and diffusion furnaces with maximum revenue; and Semiconductor Fabrication Solutions, which includes consumables, equipment and services for wafer polishing, dicing and cleaning. The majority of revenue is derived from the United States.

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