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HPQ vs AMKR Comparison

Compare HPQ & AMKR Stocks: Price Trends, ML Decisions, Charts, Trends, Technical Analysis and more.

Logo HP Inc.

HPQ

HP Inc.

HOLD

Current Price

$26.43

Market Cap

19.8B

Sector

Technology

ML Signal

HOLD

Logo Amkor Technology Inc.

AMKR

Amkor Technology Inc.

HOLD

Current Price

$59.45

Market Cap

15.6B

Sector

Technology

ML Signal

HOLD

Company Overview

Basic Information
Metric
HPQ
AMKR
Founded
1939
1968
Country
United States
United States
Employees
N/A
N/A
Industry
Computer Manufacturing
Semiconductors
Sector
Technology
Technology
Exchange
Nasdaq
Nasdaq
Market Cap
19.8B
15.6B
IPO Year
2002
1997

Fundamental Metrics

Financial Performance
Metric
HPQ
AMKR
Price
$26.43
$59.45
Analyst Decision
Hold
Buy
Analyst Count
12
8
Target Price
$21.42
$64.50
AVG Volume (30 Days)
13.6M
4.4M
Earning Date
05-27-2026
04-27-2026
Dividend Yield
5.96%
0.47%
EPS Growth
N/A
4.90
EPS
1.07
0.33
Revenue
$55,295,000,000.00
$4,052,650,000.00
Revenue This Year
$3.10
$13.24
Revenue Next Year
$0.39
$9.90
P/E Ratio
$24.07
$198.03
Revenue Growth
3.24
N/A
52 Week Low
$17.56
$21.57
52 Week High
$29.65
$96.68

Technical Indicators

Market Signals
Indicator
HPQ
AMKR
Relative Strength Index (RSI) 64.74 41.30
Support Level $18.00 $62.31
Resistance Level $29.32 $79.23
Average True Range (ATR) 0.94 4.06
MACD 0.23 -0.36
Stochastic Oscillator 95.92 37.91

Price Performance

Historical Comparison
HPQ
AMKR

About HPQ HP Inc.

HP (formerly Hewlett-Packard) is a behemoth in the PC and printing markets. It has focused on these markets since it exited IT infrastructure in 2015 with the split from Hewlett Packard Enterprise. HP focuses on the commercial market, but maintains sales of consumer devices and printers. The firm has a broad and global customer base, with only one third of sales coming from the US. HP completely outsources manufacturing and relies heavily on channel partners for its sales and marketing.

About AMKR Amkor Technology Inc.

Amkor Technology Inc is a OSAT (outsourced semiconductor assembly and test) service provider. It has pioneered the outsourcing of integrated circuit (IC) packaging and test services and is a strategic manufacturing partner for the semiconductor companies, foundries, and electronics original equipment manufacturers (OEMs). The firm's products are organized into two categories namely advanced products that include flip chip, fine pitch bumping, wafer-level processing, advanced SiPs, power modules, and others, and Mainstream products that includes wirebond packaging and testing. The company derives maximum revenue from the advanced products category. The company derives majority of its revenue from Foreign states.

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