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- HLP vs SHMD Comparison
HLP vs SHMD Comparison
Compare HLP & SHMD Stocks: Price Trends, ML Decisions, Charts, Trends, Technical Analysis and more.
- Machine Learning Prediction
- ML Decision
- HLP
- SHMD
- Stock Information
- Founded
- HLP 2021
- SHMD 1864
- Country
- HLP China
- SHMD Germany
- Employees
- HLP N/A
- SHMD N/A
- Industry
- HLP Industrial Machinery/Components
- SHMD
- Sector
- HLP Industrials
- SHMD
- Exchange
- HLP Nasdaq
- SHMD Nasdaq
- Market Cap
- HLP 94.0M
- SHMD 86.1M
- IPO Year
- HLP 2023
- SHMD N/A
- Fundamental
- Price
- HLP $1.03
- SHMD $2.91
- Analyst Decision
- HLP
- SHMD
- Analyst Count
- HLP 0
- SHMD 0
- Target Price
- HLP N/A
- SHMD N/A
- AVG Volume (30 Days)
- HLP 65.4K
- SHMD 42.6K
- Earning Date
- HLP 04-25-2025
- SHMD 02-25-2025
- Dividend Yield
- HLP N/A
- SHMD N/A
- EPS Growth
- HLP N/A
- SHMD 1309.32
- EPS
- HLP N/A
- SHMD 1.07
- Revenue
- HLP $14,045,084.00
- SHMD $99,752,404.00
- Revenue This Year
- HLP N/A
- SHMD N/A
- Revenue Next Year
- HLP N/A
- SHMD N/A
- P/E Ratio
- HLP N/A
- SHMD $2.71
- Revenue Growth
- HLP N/A
- SHMD N/A
- 52 Week Low
- HLP $0.90
- SHMD $1.86
- 52 Week High
- HLP $2.25
- SHMD $6.13
- Technical
- Relative Strength Index (RSI)
- HLP 37.91
- SHMD N/A
- Support Level
- HLP $0.92
- SHMD N/A
- Resistance Level
- HLP $1.09
- SHMD N/A
- Average True Range (ATR)
- HLP 0.10
- SHMD 0.00
- MACD
- HLP -0.02
- SHMD 0.00
- Stochastic Oscillator
- HLP 32.50
- SHMD 0.00
About HLP Hongli Group Inc.
Hongli Group Inc is a cold roll formed steel profile manufacturer in China. It customizes and manufactures cold roll formed steel profiles for machinery and equipment in a variety of sectors, including but not limited to mining and excavation, construction, agriculture and transportation.
About SHMD SCHMID Group N.V. Class A Ordinary Shares
Schmid Group NV is a global supplier of equipment, software and services for various industries such as printed circuit board (PCB), substrate manufacturing, photovoltaics, and glass and energy storage with a focus on the highest end of this market in terms of technology and performance. It focuses on a modular product portfolio of machinery to use in the manufacturing of high-end PCB equipment and semiconductor packaging devices which includes common flexible circuit fabrication techniques such as subtractive, semi-additive processes (SAP) and modified semi-additive processes (mSAP).