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ELLO vs SHMD Comparison

Compare ELLO & SHMD Stocks: Price Trends, ML Decisions, Charts, Trends, Technical Analysis and more.

ELLO

Ellomay Capital Ltd (Israel)

HOLD

Current Price

$24.50

Market Cap

332.1M

Sector

Utilities

ML Signal

HOLD

Logo SCHMID Group N.V. Class A Ordinary Shares

SHMD

SCHMID Group N.V. Class A Ordinary Shares

HOLD

Current Price

$5.98

Market Cap

301.4M

Sector

N/A

ML Signal

HOLD

Company Overview

Basic Information
Metric
ELLO
SHMD
Founded
1987
1864
Country
Israel
Germany
Employees
N/A
676
Industry
Electric Utilities: Central
Sector
Utilities
Exchange
Nasdaq
Nasdaq
Market Cap
332.1M
301.4M
IPO Year
1998
N/A

Fundamental Metrics

Financial Performance
Metric
ELLO
SHMD
Price
$24.50
$5.98
Analyst Decision
Analyst Count
0
0
Target Price
N/A
N/A
AVG Volume (30 Days)
5.2K
842.2K
Earning Date
03-31-2026
05-15-2026
Dividend Yield
N/A
N/A
EPS Growth
N/A
N/A
EPS
N/A
N/A
Revenue
N/A
N/A
Revenue This Year
N/A
N/A
Revenue Next Year
N/A
N/A
P/E Ratio
N/A
N/A
Revenue Growth
N/A
N/A
52 Week Low
$13.21
$2.00
52 Week High
$30.34
$10.65

Technical Indicators

Market Signals
Indicator
ELLO
SHMD
Relative Strength Index (RSI) 45.07 49.89
Support Level $24.11 $5.75
Resistance Level $25.70 $7.19
Average True Range (ATR) 0.96 0.67
MACD 0.03 -0.02
Stochastic Oscillator 18.98 34.50

Price Performance

Historical Comparison
ELLO
SHMD

About ELLO Ellomay Capital Ltd (Israel)

Ellomay Capital Ltd is a renewable energy company. It develops and operates renewable energy projects in Europe, the USA, and Israel, employing diverse technologies such as solar power, natural gas, pumped hydro, and waste-to-energy solutions.

About SHMD SCHMID Group N.V. Class A Ordinary Shares

Schmid Group NV is a global supplier of equipment, software and services for various industries such as printed circuit board (PCB), substrate manufacturing, photovoltaics, and glass and energy storage with a focus on the highest end of this market in terms of technology and performance. It focuses on a modular product portfolio of machinery to use in the manufacturing of high-end PCB equipment and semiconductor packaging devices which includes common flexible circuit fabrication techniques such as subtractive, semi-additive processes (SAP) and modified semi-additive processes (mSAP).

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