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DSP vs ASYS Comparison

Compare DSP & ASYS Stocks: Price Trends, ML Decisions, Charts, Trends, Technical Analysis and more.

Logo Viant Technology Inc.

DSP

Viant Technology Inc.

HOLD

Current Price

$10.60

Market Cap

213.3M

Sector

Technology

ML Signal

HOLD

Logo Amtech Systems Inc.

ASYS

Amtech Systems Inc.

HOLD

Current Price

$17.01

Market Cap

233.5M

Sector

Technology

ML Signal

HOLD

Company Overview

Basic Information
Metric
DSP
ASYS
Founded
1999
1981
Country
United States
United States
Employees
N/A
N/A
Industry
EDP Services
Industrial Machinery/Components
Sector
Technology
Technology
Exchange
Nasdaq
Nasdaq
Market Cap
213.3M
233.5M
IPO Year
2021
2006

Fundamental Metrics

Financial Performance
Metric
DSP
ASYS
Price
$10.60
$17.01
Analyst Decision
Strong Buy
Analyst Count
8
0
Target Price
$17.81
N/A
AVG Volume (30 Days)
179.7K
210.2K
Earning Date
05-11-2026
05-07-2026
Dividend Yield
N/A
N/A
EPS Growth
157.14
N/A
EPS
0.36
0.01
Revenue
$344,201,000.00
$79,364,000.00
Revenue This Year
$20.27
$2.82
Revenue Next Year
$16.88
$18.75
P/E Ratio
$29.56
$1,677.00
Revenue Growth
19.00
N/A
52 Week Low
$8.11
$3.35
52 Week High
$16.25
$19.74

Technical Indicators

Market Signals
Indicator
DSP
ASYS
Relative Strength Index (RSI) 48.22 58.64
Support Level $8.49 $10.84
Resistance Level $10.73 $18.00
Average True Range (ATR) 0.69 1.39
MACD -0.04 0.07
Stochastic Oscillator 39.36 50.83

Price Performance

Historical Comparison
DSP
ASYS

About DSP Viant Technology Inc.

Viant Technology Inc is an advertising software company. The software enables the programmatic purchase of advertising, which is the electronification of the advertising buying process. It operates a cloud-based demand side platform ("DSP") that is used by marketers and its advertising agencies to centralize the planning, buying and measurement of its advertising across channels, including connected TV (CTV), streaming audio, digital out-of-home, mobile and desktop.

About ASYS Amtech Systems Inc.

Amtech Systems Inc provides equipment, consumables and services for semiconductor device packaging, wafer production and device fabrication. Its products are used to fabricate and package GPUs for AI applications, SiC and Si power devices, and other optical, analog and digital devices, and are sold to semiconductor packaging, electronic assembly and device fabrication companies. It operates through two segments: Thermal Processing Solutions, which includes conveyorized reflow equipment, high-temperature conveyorized furnaces and diffusion furnaces with maximum revenue; and Semiconductor Fabrication Solutions, which includes consumables, equipment and services for wafer polishing, dicing and cleaning. The majority of revenue is derived from the United States.

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