- Home
- BUJA vs ASYS Comparison
BUJA vs ASYS Comparison
Compare BUJA & ASYS Stocks: Price Trends, ML Decisions, Charts, Trends, Technical Analysis and more.
- Machine Learning Prediction
- ML Decision
- BUJA
- ASYS
- Stock Information
- Founded
- BUJA 2022
- ASYS 1981
- Country
- BUJA Malaysia
- ASYS United States
- Employees
- BUJA N/A
- ASYS N/A
- Industry
- BUJA Blank Checks
- ASYS Industrial Machinery/Components
- Sector
- BUJA Finance
- ASYS Technology
- Exchange
- BUJA Nasdaq
- ASYS Nasdaq
- Market Cap
- BUJA N/A
- ASYS 89.7M
- IPO Year
- BUJA 2023
- ASYS N/A
- Fundamental
- Price
- BUJA $10.96
- ASYS $5.62
- Analyst Decision
- BUJA
- ASYS Hold
- Analyst Count
- BUJA 0
- ASYS 1
- Target Price
- BUJA N/A
- ASYS N/A
- AVG Volume (30 Days)
- BUJA 2.7K
- ASYS 34.5K
- Earning Date
- BUJA 01-01-0001
- ASYS 12-04-2024
- Dividend Yield
- BUJA N/A
- ASYS N/A
- EPS Growth
- BUJA N/A
- ASYS N/A
- EPS
- BUJA 0.29
- ASYS N/A
- Revenue
- BUJA N/A
- ASYS $104,809,000.00
- Revenue This Year
- BUJA N/A
- ASYS N/A
- Revenue Next Year
- BUJA N/A
- ASYS $10.86
- P/E Ratio
- BUJA $37.13
- ASYS N/A
- Revenue Growth
- BUJA N/A
- ASYS N/A
- 52 Week Low
- BUJA $10.30
- ASYS $3.37
- 52 Week High
- BUJA $12.18
- ASYS $8.11
- Technical
- Relative Strength Index (RSI)
- BUJA 67.66
- ASYS 46.57
- Support Level
- BUJA $10.85
- ASYS $5.59
- Resistance Level
- BUJA $10.85
- ASYS $5.98
- Average True Range (ATR)
- BUJA 0.00
- ASYS 0.25
- MACD
- BUJA -0.00
- ASYS 0.02
- Stochastic Oscillator
- BUJA 87.50
- ASYS 43.75
About BUJA Bukit Jalil Global Acquisition 1 Ltd.
Bukit Jalil Global Acquisition 1 Ltd is a blank check company.
About ASYS Amtech Systems Inc.
Amtech Systems Inc is a manufacturer of capital equipment, including thermal processing and wafer polishing, and related consumables used in fabricating semiconductor devices, such as silicon carbide (SiC) and silicon power chips, electronic assemblies, and light-emitting diodes (LEDs). the company has two segments; Semiconductor; it designs, manufactures, sells, and services thermal processing equipment and related controls for use by semiconductor manufacturers, and in electronics, automotive, and other industries; and Material and Substrate - it produces consumables and machinery for lapping (fine abrading) and polishing of materials, such as sapphire substrates, optical components, silicon wafers, numerous types of crystal materials, ceramics and metal components.