Compare BMBL & SHMD Stocks: Price Trends, ML Decisions, Charts, Trends, Technical Analysis and more.
Current Price
| Metric | BMBL | SHMD |
|---|---|---|
| Founded | 2014 | 1864 |
| Country | United States | Germany |
| Employees | N/A | N/A |
| Industry | Computer Software: Prepackaged Software | |
| Sector | Technology | |
| Exchange | Nasdaq | Nasdaq |
| Market Cap | 403.6M | 323.0M |
| IPO Year | 2021 | N/A |
| Metric | BMBL | SHMD |
|---|---|---|
| Price | $3.54 | $8.18 |
| Analyst Decision | Hold | |
| Analyst Count | 13 | 0 |
| Target Price | ★ $4.83 | N/A |
| AVG Volume (30 Days) | ★ 2.7M | 500.6K |
| Earning Date | 02-17-2026 | 01-01-0001 |
| Dividend Yield | N/A | N/A |
| EPS Growth | N/A | N/A |
| EPS | N/A | ★ N/A |
| Revenue | ★ $1,003,141,000.00 | $85,165,542.00 |
| Revenue This Year | N/A | N/A |
| Revenue Next Year | N/A | N/A |
| P/E Ratio | N/A | N/A |
| Revenue Growth | ★ N/A | N/A |
| 52 Week Low | $3.18 | $1.86 |
| 52 Week High | $8.82 | $9.98 |
| Indicator | BMBL | SHMD |
|---|---|---|
| Relative Strength Index (RSI) | 45.09 | 59.13 |
| Support Level | $3.43 | $7.33 |
| Resistance Level | $3.79 | $9.98 |
| Average True Range (ATR) | 0.17 | 1.12 |
| MACD | 0.02 | 0.01 |
| Stochastic Oscillator | 34.18 | 43.87 |
Bumble Inc is engaged in offering online dating services. The platform enables people to connect and build healthy and equitable relationships on their own terms. The company operates two apps, Bumble and Badoo, where users come every month to discover new people and connect. The company Operates in USA and also Internationally such as United Kingdom, Czech Republic, and others with maximum of revenue from Other Countries.
Schmid Group NV is a global supplier of equipment, software and services for various industries such as printed circuit board (PCB), substrate manufacturing, photovoltaics, and glass and energy storage with a focus on the highest end of this market in terms of technology and performance. It focuses on a modular product portfolio of machinery to use in the manufacturing of high-end PCB equipment and semiconductor packaging devices which includes common flexible circuit fabrication techniques such as subtractive, semi-additive processes (SAP) and modified semi-additive processes (mSAP).