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BMBL vs ASYS Comparison

Compare BMBL & ASYS Stocks: Price Trends, ML Decisions, Charts, Trends, Technical Analysis and more.

Logo Bumble Inc.

BMBL

Bumble Inc.

HOLD

Current Price

$2.81

Market Cap

417.4M

Sector

Technology

ML Signal

HOLD

Logo Amtech Systems Inc.

ASYS

Amtech Systems Inc.

HOLD

Current Price

$17.34

Market Cap

341.5M

Sector

Technology

ML Signal

HOLD

Company Overview

Basic Information
Metric
BMBL
ASYS
Founded
2014
1981
Country
United States
United States
Employees
N/A
N/A
Industry
Computer Software: Prepackaged Software
Industrial Machinery/Components
Sector
Technology
Technology
Exchange
Nasdaq
Nasdaq
Market Cap
417.4M
341.5M
IPO Year
2021
2006

Fundamental Metrics

Financial Performance
Metric
BMBL
ASYS
Price
$2.81
$17.34
Analyst Decision
Hold
Analyst Count
13
0
Target Price
$4.46
N/A
AVG Volume (30 Days)
4.0M
481.2K
Earning Date
05-05-2026
05-07-2026
Dividend Yield
N/A
N/A
EPS Growth
N/A
N/A
EPS
0.34
0.09
Revenue
$965,658,000.00
$79,364,000.00
Revenue This Year
N/A
$2.82
Revenue Next Year
N/A
$18.75
P/E Ratio
$8.44
$199.78
Revenue Growth
N/A
N/A
52 Week Low
$2.54
$4.30
52 Week High
$8.63
$25.71

Technical Indicators

Market Signals
Indicator
BMBL
ASYS
Relative Strength Index (RSI) 40.04 45.04
Support Level $2.64 $16.93
Resistance Level $3.23 $18.00
Average True Range (ATR) 0.16 1.26
MACD -0.02 -0.13
Stochastic Oscillator 1.50 36.10

Price Performance

Historical Comparison
BMBL
ASYS

About BMBL Bumble Inc.

Bumble Inc is engaged in offering online dating services. The platform enables people to connect and build healthy and equitable relationships on their own terms. The company operates two apps, Bumble and Badoo, where users come every month to discover new people and connect. The company operates as one operating segment with revenue derived in the form of recurring subscriptions and in-app purchases. The company operates in USA, which derives maximum revenue; and Rest of the World.

About ASYS Amtech Systems Inc.

Amtech Systems Inc provides equipment, consumables and services for semiconductor device packaging, wafer production and device fabrication. Its products are used to fabricate and package GPUs for AI applications, SiC and Si power devices, and other optical, analog and digital devices, and are sold to semiconductor packaging, electronic assembly and device fabrication companies. It operates through two segments: Thermal Processing Solutions, which includes conveyorized reflow equipment, high-temperature conveyorized furnaces and diffusion furnaces with maximum revenue; and Semiconductor Fabrication Solutions, which includes consumables, equipment and services for wafer polishing, dicing and cleaning. The majority of revenue is derived from the United States.

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