Compare AOS & AMKR Stocks: Price Trends, ML Decisions, Charts, Trends, Technical Analysis and more.
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| Metric | AOS | AMKR |
|---|---|---|
| Founded | 1874 | 1968 |
| Country | | |
| Employees | N/A | N/A |
| Industry | Industrial Machinery/Components | Semiconductors |
| Sector | Industrials | Technology |
| Exchange | Nasdaq | Nasdaq |
| Market Cap | 11.0B | 12.9B |
| IPO Year | N/A | N/A |
| Metric | AOS | AMKR |
|---|---|---|
| Price | $79.67 | $46.54 |
| Analyst Decision | Hold | Buy |
| Analyst Count | 8 | 9 |
| Target Price | ★ $78.63 | $52.88 |
| AVG Volume (30 Days) | 1.6M | ★ 5.0M |
| Earning Date | 01-01-0001 | 01-01-0001 |
| Dividend Yield | ★ 1.79% | 0.70% |
| EPS Growth | N/A | N/A |
| EPS | N/A | N/A |
| Revenue | N/A | N/A |
| Revenue This Year | $4.93 | $10.39 |
| Revenue Next Year | $3.83 | $9.87 |
| P/E Ratio | ★ $20.64 | $31.23 |
| Revenue Growth | N/A | N/A |
| 52 Week Low | $58.83 | $14.03 |
| 52 Week High | $81.87 | $57.09 |
| Indicator | AOS | AMKR |
|---|---|---|
| Relative Strength Index (RSI) | 68.48 | 46.36 |
| Support Level | $78.39 | $42.14 |
| Resistance Level | $81.87 | $57.09 |
| Average True Range (ATR) | 1.85 | 3.77 |
| MACD | 0.31 | -0.38 |
| Stochastic Oscillator | 82.13 | 30.70 |
A.O. Smith manufactures a broad lineup of water heaters, boilers, and water treatment products. The company has two reporting segments: North America (75% of sales) and rest of world (25% of sales). A.O. Smith is the leading manufacturer of water heaters in North America for the residential and commercial markets, with approximately 37% and 54% market share, respectively. Residential water heaters account for most of North American sales and are distributed equally through wholesale and retail channels. Most of A.O. Smith's international revenue is from China, a market the company entered during the mid-1990s. However, the firm announced a strategic review of its China operations.
Amkor Technology Inc is a OSAT (outsourced semiconductor assembly and test) service provider. It has pioneered the outsourcing of integrated circuit (IC) packaging and test services and is a strategic manufacturing partner for the semiconductor companies, foundries, and electronics original equipment manufacturers (OEMs). The firm's products are organized into two categories namely advanced products that include flip chip, fine pitch bumping, wafer-level processing, advanced SiPs, power modules, and others, and Mainstream products that includes wirebond packaging and testing. The company derives maximum revenue from the advanced products category. The company derives majority of its revenue from Foreign states.