Compare OC & AMKR Stocks: Price Trends, ML Decisions, Charts, Trends, Technical Analysis and more.
Current Price
Current Price
| Metric | OC | AMKR |
|---|---|---|
| Founded | 1938 | 1968 |
| Country | United States | United States |
| Employees | N/A | N/A |
| Industry | Industrial Machinery/Components | Semiconductors |
| Sector | Industrials | Technology |
| Exchange | Nasdaq | Nasdaq |
| Market Cap | 9.3B | 7.7B |
| IPO Year | N/A | 1998 |
| Metric | OC | AMKR |
|---|---|---|
| Price | $114.29 | $37.71 |
| Analyst Decision | Buy | Buy |
| Analyst Count | 13 | 8 |
| Target Price | ★ $160.33 | $34.86 |
| AVG Volume (30 Days) | 2.2M | ★ 3.4M |
| Earning Date | 11-05-2025 | 10-27-2025 |
| Dividend Yield | ★ 2.43% | 0.88% |
| EPS Growth | ★ N/A | N/A |
| EPS | N/A | ★ 1.24 |
| Revenue | ★ $11,659,000,000.00 | $6,449,053,000.00 |
| Revenue This Year | N/A | $7.30 |
| Revenue Next Year | $0.47 | $8.45 |
| P/E Ratio | ★ N/A | $30.44 |
| Revenue Growth | ★ 21.69 | 0.14 |
| 52 Week Low | $97.53 | $14.03 |
| 52 Week High | $206.47 | $38.22 |
| Indicator | OC | AMKR |
|---|---|---|
| Relative Strength Index (RSI) | 52.96 | 66.01 |
| Support Level | $97.53 | $30.03 |
| Resistance Level | $105.79 | $33.85 |
| Average True Range (ATR) | 3.51 | 1.71 |
| MACD | 2.44 | 0.36 |
| Stochastic Oscillator | 92.06 | 96.25 |
Owens-Corning Inc is a manufacturer of glass fiber utilized in composites and building materials. It has an integrated business model with four reportable segments: Composites, Insulation, Doors, and Roofing. It generates maximum revenue from the Roofing segment. Its Roofing segment laminate and strip asphalt roofing shingles, roofing components, synthetic packaging materials, and oxidized asphalt. It meets the growing demand for longer-lasting, aesthetically attractive laminate products with modest capital investment. Geographically the company generates the majority of its revenue from the United States.
Amkor Technology Inc is a OSAT (outsourced semiconductor assembly and test) service provider. It has pioneered the outsourcing of integrated circuit (IC) packaging and test services and is a strategic manufacturing partner for the semiconductor companies, foundries, and electronics original equipment manufacturers (OEMs). The firm's products are organized into two categories namely advanced products that include flip chip, fine pitch bumping, wafer-level processing, advanced SiPs, power modules, and others, and Mainstream products that includes wirebond packaging and testing. The company derives maximum revenue from the advanced products category. The company derives majority of its revenue from Foreign states.